Substrate holding device, substrate handling robot equipped with the substrate holding device, reversing device, and substrate holding method

Abstract

A substrate holding apparatus and a substrate handling method are provided for holding warped substrates (e.g., semiconductor substrates, liquid crystal substrates, or other thin-plate substrates), and a substrate handling robot and a reversing device using these apparatus and methods. The substrate holding apparatus includes: a plurality of rods (30) having a plurality of separately arranged suction portions (33) for attracting and holding a semiconductor wafer or other substrate (60); a base (12) supported in such a manner that the angle of at least one of the plurality of rods (30a, 30b) relative to the horizontal plane in its length direction can be changed; and an angle changing portion (15, 20-25) for changing the aforementioned angle of the rods (30a, 30b). By using the angle changing portion (15, 20-25) to change the tilt angle of the rods (30a, 30b) in the length direction, the suction point of the substrate is determined, thereby reliably holding the substrate.

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