Connecting component and semiconductor process equipment

Abstract

This application discloses a connecting component and semiconductor process equipment, belonging to the technical field of semiconductor processing. The connecting component is connected between a process chamber and a transfer chamber. The connecting component includes a connecting plate, a first sealing ring, and a second sealing ring. The connecting plate is provided with a transfer port, which penetrates through the connecting plate along its thickness direction. The first surface of the connecting plate facing the process chamber is provided with a first sealing groove and a second sealing groove, with the second sealing groove arranged around and outside the first sealing groove. The first sealing ring is disposed in the first sealing groove, and the second sealing ring is disposed in the second sealing groove. Both the first and second sealing rings are used to seal the first surface of the connecting plate to the process chamber. The above-mentioned connecting component can solve the problem in current semiconductor process equipment where the sealing ring arranged between the process chamber and the connecting plate is prone to failure.

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