Die-bonding apparatus, die-bonding method and method for manufacturing semiconductor devices

Abstract

The objective of this invention is to provide a technique that improves the accuracy of die-to-substrate alignment. The solution involves a die-bonding apparatus comprising a bonding head, a bonding stage for placing the substrate, and a control unit. The bonding head comprises a fixing member and a movable member, wherein the rotation center of the movable member is located below the die. The movable member has a clamp that holds the die at its lower end and is oscillatingly disposed relative to the fixing member. The control unit is configured to control the bonding head so that, each time the die is placed on the substrate, the lower surface of the die is aligned and held on the substrate above the bonding stage.

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