Optical calibration imaging system and optical calibration method
The optical calibration imaging system addresses alignment inaccuracies in wafer bonding by using detection images to calculate and correct for optical device shifts, enhancing precision.
TW202633359APending Publication Date: 2026-08-01SABERS CO LTD
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Patent Information
- Application Number
- TW115101685
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-15
- Filing Date
- 2026-01-15
- Publication Date
- 2026-08-01
AI Technical Summary
Technical Problem
The alignment accuracy of wafers in the bonding process is compromised due to temperature changes and vibrations affecting top-and-bottom aligned microscopic imaging systems, leading to random or trend-like relative displacements.
Method used
An optical calibration imaging system with a detection light source and optical components forming detection images in two imaging units, allowing for the calculation of actual offsets to compensate for alignment errors.
Benefits of technology
Improves alignment accuracy by compensating for optical device shifts, ensuring precise wafer bonding through error detection and correction.
✦ Generated by Eureka AI based on patent content.
Abstract
An optical calibration imaging system and an optical calibration method are disclosed. The optical calibration imaging system includes: a first imaging unit
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