Structure for plasma processing equipment
TW202633360APending Publication Date: 2026-08-01TOKYO ELECTRON LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- TOKYO ELECTRON LTD
- Filing Date
- 2025-07-24
- Publication Date
- 2026-08-01
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Abstract
This invention provides a structure for a plasma processing apparatus, comprising a first component, a second component, a plurality of support components, a plurality of adjustment components, and a cylindrical component. The first component has a first surface. The second component has a second surface facing the first surface. The plurality of support components and the plurality of adjustment components are disposed between the first and second surfaces. The cylindrical component extends through the space between the first and second surfaces. The plurality of support components are arranged at different densities in a first space below a first unit area on the first surface, where no cylindrical component is disposed, and in a second space below a second unit area on the first surface, where a cylindrical component is disposed and has the same volume as the first space. The plurality of adjustment components are arranged at different densities in the first and second spaces.
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