Modification equipment, processing system and processing method

Abstract

The present invention relates to a modification apparatus for modifying the surface of a bare die held by an adhesive tape frame by plasma modification, comprising: a processing container; a gas supply unit for supplying processing gas into the processing container; a plasma generation unit configured to generate plasma of the processing gas in the processing container; and a support unit disposed in the processing container and supporting the adhesive tape frame, wherein a cover is provided on the adhesive tape frame supported by the support unit, which is configured to surround the bare die held by the adhesive tape frame for protecting the surface of the adhesive tape frame.

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