Bonding sheets, methods of using bonding sheets, and methods of manufacturing semiconductor devices.

Abstract

The present invention provides a bonding sheet comprising: a substrate and an adhesive layer disposed on one side of the substrate; the transmittance of infrared light with a wavelength of 1600 nm of the bonding sheet is 80% or more; and the peel force between the energy irradiant of the adhesive layer and the silicon wafer is measured to be 5N or less using a test piece that is a silicon wafer, an energy irradiant of the adhesive layer, and a laminate of the substrate.

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