Semiconductor component manufacturing method, pick-up strip, and semiconductor component manufacturing apparatus

Abstract

The method for manufacturing a semiconductor component includes a pick-up step R3. The semiconductor component includes a semiconductor wafer 10 with a thickness of 50 μm or less. The pick-up step R3 is as follows: a portion of the plurality of semiconductor wafers 10 held in a strip 20 is selected as a pick-up object 10A, the holding force of the strip 20 on the pick-up object 10A is lost, and the pick-up object 10A is separated from the strip 20 without applying an upward displacement to the strip 20.

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