An article configured for receiving an object for high temperature processing and a method of manufacturing said article

TW202633373APending Publication Date: 2026-08-01SCHUNK XYCARB TECH BV
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
SCHUNK XYCARB TECH BV
Filing Date
2025-12-17
Publication Date
2026-08-01

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Abstract

The disclosure pertains to article and a method of manufacturing said article. The article is configured for receiving an object for thermal processing, preferably said object being a semiconductor wafer, wherein the article comprises a porous structure having an internal arrangement corresponding to a fibrous material, said article material being silicon carbide (SiC).
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