High temperature furnace tube

TW202633374APending Publication Date: 2026-08-01ACM RES (SHANGHAI) INC +3
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
ACM RES (SHANGHAI) INC
Filing Date
2022-02-17
Publication Date
2026-08-01

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Abstract

This invention discloses a high-temperature furnace tube, comprising: a process tube with a top cover and a through hole at its top; a gas supply pipe communicating with the through hole on the top cover of the process tube, through which process gas enters the interior of the process tube; and a crystal boat disposed inside the process tube, comprising a support frame and support plates, wherein multiple layers of support plates are distributed along the length of the support frame to support multiple substrates, each substrate being placed on each layer of support plates, and each layer of support plates supporting the entire bottom of each substrate. By setting multiple layers of support plates, with each layer supporting the entire bottom of each substrate, this invention avoids downward deformation of the substrate under high-temperature processes above 1200°C, thus preventing the generation of lattice defects within the substrate and improving wafer yield.
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