Semiconductor processing device

TW202633377APending Publication Date: 2026-08-01HITACHI HIGH TECH CORP
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
HITACHI HIGH TECH CORP
Filing Date
2025-08-11
Publication Date
2026-08-01

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Abstract

The purpose of this disclosure is to provide a semiconductor processing apparatus that can simultaneously achieve high-speed sample exchange and low-vibration wafer handling robot. The semiconductor processing apparatus disclosed herein performs: a first operation of unloading a sample from a platform; a second operation of loading a sample onto the platform; at least a portion of the first operation and at least a portion of the second operation are performed in parallel; the second operation ends before the first operation ends.
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