Wafer chuck having vapor chamber

Abstract

A wafer chuck with a vapor chamber is disclosed. According to one aspect of the invention, a wafer chuck with a vapor chamber may include: an adsorption chuck for adsorbing a wafer on one side; a vapor chamber disposed on another side of the adsorption chuck for diffusing heat transferred from the wafer to the adsorption chuck; a cooling layer disposed on another side of the vapor chamber and comprising a refrigerant maintained at a temperature below that of the adsorption chuck to dissipate heat diffused from the vapor chamber; and a heater for heating the adsorption chuck to maintain it at a certain temperature.

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