A workpiece stage assembly, semiconductor manufacturing equipment and method

Abstract

This invention provides a workpiece stage assembly, semiconductor manufacturing equipment, and method. The workpiece stage assembly includes a workpiece stage body and an edge-pressing mechanism. The workpiece stage body includes a suction cup base and a suction cup, with the suction cup mounted on the suction cup base. Multiple edge-pressing mechanisms are arranged around the outer periphery of the suction cup. Each edge-pressing mechanism includes a horizontal drive member, a vertical drive member, and a pressure plate. The horizontal drive member is connected to the suction cup base, the vertical drive member is connected to the horizontal drive member, and the pressure plate is connected to the vertical drive member. When the horizontal and vertical drive members are in their current states, the pressure plate is relatively stationary relative to the suction cup. The workpiece stage assembly is used in semiconductor manufacturing equipment. When the semiconductor manufacturing equipment is operating, it performs the following actions: suctioning a substrate with the suction cup; detecting whether the substrate's state meets preset application conditions; if so, executing a preset operation; if not, using the edge-pressing mechanisms to press the edge online, and then executing the preset operation again, ensuring the successful execution of the preset operation.

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