Cleaning sheet bonding device for semiconductor probe cards

Abstract

The objective of this invention is to provide a cleaning sheet bonding device for semiconductor probe cards that can suppress variations in cleaning performance. The means to solve the problem is a cleaning sheet bonding device for semiconductor probe cards, comprising: a first stage capable of vacuum adsorbing the second surface of a flexible semiconductor probe card cleaning sheet opposite to the adhesive surface, i.e., the first surface; a second stage capable of vacuum adsorbing the fourth surface opposite to the third surface of the component to be bonded; a driving mechanism that moves the first and second stages relative to each other; a suction mechanism capable of switching the first and second stages to an adsorption state or an adsorption release state; and a control device that controls the driving mechanism and the suction mechanism, such that the first and second stages, in the adsorption state, sequentially move to an opposing state where the first surface and the third surface are opposite, an attachment state where the first surface is bonded to the third surface, and an avoidance state where the first stage avoids the cleaning sheet in the adsorption release state.

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