Process chamber and semiconductor processing equipment

Abstract

This application discloses a process chamber and semiconductor processing equipment. The process chamber comprises: a chamber body, including an annular sidewall, and a cover member sealing the top surface of the annular sidewall. A first annular base is protrudingly provided on the inner wall of the annular sidewall, wherein the first annular base is provided with a first measurement channel penetrating from the bottom surface to the top surface; a support component is disposed within the first annular base; a first measurement device is disposed within the first measurement channel; a first reflecting member is disposed between the cover member and the first annular base, for reflecting light from a first target region to the first measurement device, wherein the first target region at least includes a portion of a first annular region from the edge of the wafer to the edge of the support component, the first annular region being centered on the center of the support component. This application enables real-time monitoring of whether the wafer has shifted so as to reduce cost.

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