Method and apparatus for controlling the temperature of a wafer

TW202633409APending Publication Date: 2026-08-01LAM RES CORP
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
LAM RES CORP
Filing Date
2025-09-26
Publication Date
2026-08-01

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Abstract

Method of controlling the temperature of a wafer, comprising: detecting information relating to the temperature of the wafer at a first time; detecting information relating to the temperature of the wafer at a later second time; and controlling cooling or heating of the wafer based on a comparison of the detected information relating to the temperature of the wafer at the first time and the detected information relating to the temperature of the wafer at the second time.
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