Joining device and joining method

Abstract

This invention relates to a bonding apparatus and bonding method, providing a technique to improve the bonding accuracy of substrates. One aspect of the bonding apparatus includes a first holding portion, a second holding portion, a first deformable portion, and a second deformable portion. The first holding portion holds a first substrate from above. The second holding portion holds a second substrate from below. The first deformable portion causes the central portion of the first substrate held in the first holding portion to protrude downwards. The second deformable portion deforms the second substrate held in the second holding portion. Furthermore, the second deformable portion includes a fixing member and a plurality of actuators. The fixing member fixes the position of the central portion of the second holding portion. The plurality of actuators deform the peripheral portion of the second holding portion in the thickness direction.

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