Installation device and installation method

Abstract

This invention provides a mounting apparatus and method for improving the connection quality between a substrate and a semiconductor wafer by increasing the precision of image-based positioning and suppressing poor bonding between the substrate and the semiconductor wafer due to voids. Specifically, it includes: a first attachment 12 that holds a substrate α; a second attachment 23 that holds a semiconductor wafer β; and a camera 24 that captures images for measuring the position of the substrate α placed in the first attachment 12 and the position of the semiconductor wafer β held in the second attachment 23. The second attachment 23 has a plurality of camera through-holes 23c through which the optical axis L of the camera 24 passes, and at least a portion of the holding surface 23a of the semiconductor wafer β protrudes towards the first attachment 12. The camera 24 is configured to capture images of the semiconductor wafer β and the substrate α through the camera through-holes 23c.

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