Processing apparatus, substrate processing apparatus, substrate processing method, method and process for manufacturing semiconductor devices
TW202633413APending Publication Date: 2026-08-01KOKUSAI DENKI KK
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- KOKUSAI DENKI KK
- Filing Date
- 2025-11-13
- Publication Date
- 2026-08-01
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Abstract
It includes: a setting value display area, which displays multiple setting values set at the intersection of the multiple items and the multiple steps in a table format, defining the conditions of the processing substrate as a recipe for each of the multiple steps, using the axes of the aforementioned steps and the axes of the multiple items constituting the aforementioned conditions; a setting value selection indication area, configured to receive operation instructions that include at least a selection operation on the aforementioned multiple setting values; a display unit, which can display an editing screen configured to edit the aforementioned multiple setting values; and a control unit, which can receive operation instructions on the setting values in the aforementioned setting value selection indication area, control the execution of the aforementioned operation instructions on the aforementioned multiple setting values displayed in the aforementioned setting value display area, and edit the aforementioned editing screen.
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