Processing apparatus, substrate processing apparatus, substrate processing method, method and process for manufacturing semiconductor devices

TW202633413APending Publication Date: 2026-08-01KOKUSAI DENKI KK
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
KOKUSAI DENKI KK
Filing Date
2025-11-13
Publication Date
2026-08-01

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Abstract

It includes: a setting value display area, which displays multiple setting values ​​set at the intersection of the multiple items and the multiple steps in a table format, defining the conditions of the processing substrate as a recipe for each of the multiple steps, using the axes of the aforementioned steps and the axes of the multiple items constituting the aforementioned conditions; a setting value selection indication area, configured to receive operation instructions that include at least a selection operation on the aforementioned multiple setting values; a display unit, which can display an editing screen configured to edit the aforementioned multiple setting values; and a control unit, which can receive operation instructions on the setting values ​​in the aforementioned setting value selection indication area, control the execution of the aforementioned operation instructions on the aforementioned multiple setting values ​​displayed in the aforementioned setting value display area, and edit the aforementioned editing screen.
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