Substrate processing system

Abstract

The substrate processing system disclosed in this invention includes a vacuum transfer module, a plurality of process modules, and a common transmission path. The vacuum transfer module has a vacuum transfer chamber. Each of the plurality of process modules includes a first side disposed along one side of the vacuum transfer chamber, a processing chamber connected to the vacuum transfer chamber at the first side, and a second side extending on the opposite side of the first side. The common transmission path is a transmission path for powering the plurality of process modules, mounted on the second side of each of the plurality of process modules, and extending along the second side of each of the plurality of process modules.

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