Substrate processing system, substrate processing method and process

TW202633415APending Publication Date: 2026-08-01TOKYO ELECTRON LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
TOKYO ELECTRON LTD
Filing Date
2025-12-09
Publication Date
2026-08-01

Smart Images

  • Figure TWG2TA001071409_001
    Figure TWG2TA001071409_001
  • Figure TWG2TA001071409_002
    Figure TWG2TA001071409_002
  • Figure TWG2TA001071409_003
    Figure TWG2TA001071409_003
Patent Text Reader

Abstract

The present invention addresses the issue of providing a technique for increasing the yield of substrate processing. The substrate processing system of the present invention comprises: a batch processing unit for processing a plurality of substrates uniformly; a single-substrate processing unit for processing the substrates one by one; a connecting unit for relaying the substrates between the batch processing unit and the single-substrate processing unit; and a control circuit. The connecting unit has an immersion tank for storing a first processing liquid for immersing a plurality of the substrates. The control circuit performs the following control: monitoring the movement stop time of the substrates at the connecting unit; and designating substrates whose movement stop time exceeds a threshold before or after immersion in the first processing liquid as objects for remedial processing.
Need to check novelty before this filing date? Find Prior Art