Substrate processing system, substrate processing method and process
TW202633415APending Publication Date: 2026-08-01TOKYO ELECTRON LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- TOKYO ELECTRON LTD
- Filing Date
- 2025-12-09
- Publication Date
- 2026-08-01
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Abstract
The present invention addresses the issue of providing a technique for increasing the yield of substrate processing. The substrate processing system of the present invention comprises: a batch processing unit for processing a plurality of substrates uniformly; a single-substrate processing unit for processing the substrates one by one; a connecting unit for relaying the substrates between the batch processing unit and the single-substrate processing unit; and a control circuit. The connecting unit has an immersion tank for storing a first processing liquid for immersing a plurality of the substrates. The control circuit performs the following control: monitoring the movement stop time of the substrates at the connecting unit; and designating substrates whose movement stop time exceeds a threshold before or after immersion in the first processing liquid as objects for remedial processing.
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