Bonding device

TW202633416APending Publication Date: 2026-08-01SCREEN HOLDINGS CO LTD

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Patent Information

Authority / Receiving Office: TW · TW
Patent Type: Applications
Current Assignee / Owner
Filing Date: 2019-09-23
Publication Date: 2026-08-01

Application Information

Patent Timeline

23 Sep 2019

Application

01 Aug 2026

Publication

TW202633416A

IPC: H10P95/60; H10P72/70

Inventors: 三石創; 菅谷功

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Abstract

In some cases, the positional deviation between the two bonded substrates can vary greatly depending on the curvature of one of the bonded substrates. The substrate bonding apparatus of the present invention includes: a first holding portion for holding a first substrate; and a second holding portion for holding a second substrate; an initial bonding region is formed between a portion of the first substrate and a portion of the second substrate; the first substrate and the second substrate are bonded by releasing the second substrate from the second holding portion having formed the initial bonding region; and the initial bonding region is set based on information regarding the strain of the second substrate.

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