Organic wiring substrate and method for manufacturing organic wiring substrate

Abstract

An organic wiring substrate (1) is provided that can simultaneously achieve high wiring density and crosstalk suppression. An organic wiring substrate (1) includes: a plurality of stacked insulating resin films (40) and through holes formed in the insulating resin films (40). When the direction of stacking the insulating resin films (40) is taken as the stacking direction (1020), the thickness of the insulating resin films (40) in the stacking direction (1020) is greater than the equivalent circular diameter of a cross section orthogonal to the stacking direction (1020) at the center position of the through hole (20) in the stacking direction (1020), and the thickness of the insulating resin films (40) is less than 10 μm.

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