Substrate having stack via and method of manufacturing the same
The method forms conductive vias with specific through-holes and openings to prevent dielectric residue, ensuring reliable electrical connections in stacked vias, addressing the residue issue in conventional manufacturing.
TW202633428APending Publication Date: 2026-08-01CHIPBOND TECH
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Patent Information
- Application Number
- TW114146302
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-01-21
- Publication Date
- 2026-08-01
AI Technical Summary
Technical Problem
Conventional methods for manufacturing conductive vias on substrates result in dielectric material residue on the first conductive material, preventing the second conductive material from forming a proper electrical connection.
Method used
A method involving the formation of conductive layers and dielectric layers with specific through-holes and openings, using photoresist layers to pattern and mask conductive materials, ensuring electrical connections are maintained through multiple layers without dielectric residue.
Benefits of technology
Prevents dielectric material residue in conductive stacked vias, ensuring proper electrical connections and contact areas meet transmission specifications, enhancing the reliability of the conductive stack.
✦ Generated by Eureka AI based on patent content.
Abstract
A substrate having stack via includes a first dielectric layer, a first conductive layer, a first conductive material, a second dielectric layer, a second conductive layer and a second conductive material. The first conductive layer and the first conductive material formed in the first dielectric layer, and the second conductive layer and the second conductive material formed in the second dielectric layer are formed of a stack via. Dielectric material used to form the first and second dielectric layers will not remain in the stack via during manufacturing. Thus, the second conductive layer can be electrically connected to the first conductive material, the contact area between the first conductive layer and the first conductive material and the contact area between the second conductive layer and the second conductive material can satisfy specification requirements for electrical transmission.
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