Power package configured for increased power density, electrical efficiency, and thermal performance

TW202633436APending Publication Date: 2026-08-01WOLFSPEED INC
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-09-23
Publication Date
2026-08-01

Smart Images

  • Figure TWG2TA001070505_001
    Figure TWG2TA001070505_001
  • Figure TWG2TA001070505_002
    Figure TWG2TA001070505_002
  • Figure TWG2TA001070505_003
    Figure TWG2TA001070505_003
Patent Text Reader

Abstract

A power package includes at least one power substrate having at least one power trace, at least one power device on the at least one power trace, signal terminals, and at least one signal connection assembly. The at least one signal connection assembly includes at least one of the following: at least one signal trace that is thinner than the at least one power trace; at least one embedded routing layer within the at least one power substrate; and / or at least one routing layer on the at least one power substrate.
Need to check novelty before this filing date? Find Prior Art