Barrier and liner for interconnects

Abstract

Embodiments herein provide a method for forming an interconnect structure, comprising: depositing a barrier layer over one or more surfaces of a feature formed in a surface of a substrate, wherein the barrier layer comprises manganese, and the one or more surfaces of the feature comprise one or more sidewall surfaces and a bottom surface; depositing a liner layer over the barrier layer, wherein the liner layer comprises ruthenium; and filling the feature with an interconnect material, wherein filling the feature comprises depositing the interconnect material on the deposited liner layer.

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