UV cure technology for bonding film surface activation

Abstract

Embodiments described herein generally relate to processes for back end of line advanced packaging assembly. More particularly, embodiments described herein relate to processes for activating silicon surfaces for hydrophilic silicon direct bonding applications. In at least one embodiment, a method for activating a substrate is provided. The method includes providing a substrate into a process chamber, the substrate including a plurality of patterned structures, at least one metal layer and a silicon surface, and curing the silicon surface of the substrate. The curing process includes flowing one or more gases into the process chamber, the one or more gases including ozone, and providing UV light while operating the process chamber at a temperature of about

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