Semiconductor package
TW202633444APending Publication Date: 2026-08-01MEDIATEK INC
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- MEDIATEK INC
- Filing Date
- 2025-10-17
- Publication Date
- 2026-08-01
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Abstract
A semiconductor package is provided. The semiconductor package includes a substrate, a die, and a molding compound. The die is mounted on the substrate. The molding compound is disposed on the substrate and surrounds the die. The molding compound includes a top surface and a first upper surface lower than the top surface. The die is exposed from the molding compound. The first upper surface of the molding compound is flush with a top surface of the die.
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