Heat conducting element and heat spreader

Abstract

A polycrystalline diamond composite material comprises a heat conducting element, a heat spreader, a lid and a chip package structure. The chip package structure includes one or more chips, one or more thermal interface materials, and a heat dissipation lip. The one or more thermal interface materials is in contact with the chip. The heat dissipation lip includes a main body and a polycrystalline diamond. The main body includes a horizontal wall section and a vertical wall section. The vertical wall section is connected with a periphery of the horizontal wall section. The horizontal wall section and the vertical wall section jointly defines a recess. The horizontal wall section has a via. The polycrystalline diamond is disposed in the via. The polycrystalline diamond is in thermal contact with the chip, and is configured to remove one or more hot spots of the chip.

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