Advanced packaging and thermal solution designs for high current density integrated circuits

Abstract

A device package comprising an integrated cooling assembly. The device package may comprise multiple semiconductor devices and one or more cold plates attached to one or more of the semiconductor devices. For example, the device package may comprise a first semiconductor device, a second semiconductor device, and a third semiconductor device, wherein the second semiconductor device is disposed adjacent to the first semiconductor device in a first direction and the third semiconductor device is disposed adjacent to the second semiconductor device in the first direction. The device package may also comprise a cold plate attached to the second semiconductor device, wherein the cold plate comprises a plurality of coolant channels that extend along a second direction perpendicular to the first direction.

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