Flexible heatsink interface

Abstract

Multi-die packages may include a cover or lid that is placed over vertical stacks of silicon dies. This lid connects to a cooling system or heatsink to dissipate heat away from the dies. However, as thermal expansion / contraction occurs, the dies may lose contact with the cover and heat may build up within the cover around the dies. To solve this problem, a cover may include a flexible membrane on the bottom surface of the cover. The flexible membrane may create an internal cavity filled with a pressurized thermally conductive liquid. The liquid may cause the flexible membrane to expand and conform to a profile of the dies as they move due to temperature changes. The flexible membrane ensures that a thermally conductive pathway is maintained between the cover and the dies to effectively dissipate heat away from the dies.

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