Semiconductor device and method for partial EMI shielding
TW202633453APending Publication Date: 2026-08-01STATS CHIPPAC LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- STATS CHIPPAC LTD
- Filing Date
- 2023-05-25
- Publication Date
- 2026-08-01
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Abstract
A semiconductor device includes a substrate. An electrical component is disposed over the substrate. An encapsulant is deposited over the electrical component. A vertical interconnect structure is disposed in the encapsulant. A shielding layer is formed over the encapsulant and vertical interconnect structure. A groove is formed in the shielding layer around the vertical interconnect structure. A portion of the shielding layer remains over the vertical interconnect structure as a contact pad.
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