Method for manufacturing a substrate with through electrodes

Abstract

The present invention is a method for manufacturing a substrate having a through electrode, comprising: a first step of attaching a first laminate having a first support substrate and a first metal layer to the substrate from one side of the substrate, such that the first metal layer is located on the substrate side, and then peeling the first support substrate from the first metal layer; a second step of forming a through hole through the first metal layer and the substrate on the substrate before the first metal layer is attached; a third step of attaching a second laminate having a second support substrate and a second metal layer to the substrate from the other side of the substrate before the through hole is formed, such that the second metal layer is located on the substrate side; and a fourth step of electroplating the second metal layer as a cathode to fill the through hole with metal.

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