Method of transferring redistribution layers from carrier substrate to cavity of glass substrate to improve uniformity of redistribution layers

Abstract

Embodiments of a method of preparing an electro-optical chip package are provided. In the method, a plurality of redistribution layers (RDL) is provided onto a first major surface of a carrier substrate. The plurality of RDL is positioned over a glass substrate in which the glass substrate includes a third major surface, a fourth major surface, and a border surface. The glass substrate has a first thickness between the fourth major surface and the third major surface and a second thickness between the fourth major surface and the border surface. The first thickness is less than the second thickness such that the third major surface defines at least in part a cavity in the glass substrate. The plurality of RDL is transferred from the carrier substrate to the cavity of the glass substrate.

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