Method of forming device package

Abstract

Embodiments of the disclosure include a method of forming a device package, comprising: forming a device containing layer over a supporting surface of a first substrate, wherein forming the device containing layer comprises: forming a plurality of first openings in a first dielectric layer that is formed over a first conductive layer, wherein the first conductive layer has a first thickness, and is formed over a first bonding layer positioned between the supporting surface and the device containing layer, and a first portion of the first conductive layer is exposed within each of a plurality of first openings formed in the first dielectric layer; forming a second conductive layer on the first portions of the first conductive layer to form a pillar in each of the first openings, wherein the pillars have a second thickness; removing the first dielectric layer, wherein a second portion of the first conductive layer is exposed after removing the first dielectric layer, and the second portion of the first conductive layer is disposed over a first portion of the first substrate; removing the second portion of the first conductive layer; positioning one or more electronic devices over the first portion of the first substrate and adjacent to a pillar, wherein the one or more electronic devices have a device thickness that is less than or equal to the second thickness of the pillar; depositing a molding material over the pillars and the one or more electronic devices; and forming, by use of a material removal process, a planar surface that comprises a portion of the molding material, a portion of the one or more electronic devices, and a portion of the pillars.