Electronic devices and methods of manufacturing electronic devices

Abstract

In one example, an electronic device include a substrate with a die paddle and a contact. An electronic component is coupled to the die paddle. A conductive connect includes a foot portion coupled to the contact and a connect plate portion coupled to the electronic component. The foot portion includes a top side, a bottom side, and an outward lateral side. A chamfer extends inward from the outward lateral side and extends to the bottom side. A conductive adhesive couples the foot portions to contact and covers the chamfer and the bottom side. An encapsulant covers the electronic component, the conductive connect, and at least portions of the substrate. The chamfer improves the bonding integrity between the conductive connect and the substrate. Other examples and related methods are also disclosed herein.

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