Semiconductor device, method of manufacturing semiconductor device and an electronic system
TW202633465APending Publication Date: 2026-08-01SAMSUNG ELECTRONICS CO LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-07-31
- Publication Date
- 2026-08-01
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Abstract
Provided is a semiconductor device including a substrate including a through via, a first redistribution layer on a first surface of the substrate, a second redistribution layer on a second surface, opposite to the first surface, of the substrate, a semiconductor chip on a second surface of the second redistribution layer, and one or more capacitors included in at least one of the substrates, the first redistribution layer, and the second redistribution layer.
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