Method for manufacturing a substrate with conductive pillars and metal paste for forming conductive pillars

Abstract

A method for manufacturing a substrate with conductive pillars includes: step a, preparing a substrate with a resist layer, the substrate having a substrate and a resist layer having holes leading to the substrate, and providing a metal paste portion containing metal particles and a volatile solvent on a surface that fills the interior of the holes and covers at least the periphery of the holes with the resist layer; step b, heating the metal paste portion to remove a portion of the volatile solvent; step c, removing a portion of the heated metal paste portion to expose the aforementioned surface, thereby forming a planarized exposed surface containing metal particles inside the holes. The conductive column precursor is a residue of metal particles and volatile solvents; step d, calcining the conductive column precursor at 200°C or below in a reducing atmosphere; and step e, removing the resist layer that has undergone step d, wherein the metal particles include a first copper particle with a volume average particle size of 0.8 μm or more and a second copper particle with a volume average particle size of 0.5 μm or less, the concentration of metal particles in the metal paste portion provided in step a is 95.0% by mass or more, and the content of the second copper particle in the metal paste portion provided in step a is 50% by mass or less based on the total amount of metal particles.

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