Package comprising integrated devices and metallization portions

TW202633467APending Publication Date: 2026-08-01QUALCOMM INC
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-10-02
Publication Date
2026-08-01

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Abstract

A package comprising a first metallization portion; a first integrated device coupled to the first metallization portion; a second integrated device coupled to the first metallization portion; a first encapsulation layer coupled to the first metallization portion; a first passive device located in the first encapsulation layer; a first bridge located in the first encapsulation layer; a second metallization portion; a second integrated device coupled to the second metallization portion; a second integrated device coupled to the second metallization portion; a second encapsulation layer coupled to the second metallization portion; a second passive device located in the second encapsulation layer; and a second bridge located in the second encapsulation layer. The package further comprises a third metallization portion and a third encapsulation layer.
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