Integrated package and method for making the same

Abstract

This application provides an integrated package and a method for manufacturing the same. The integrated package includes: a molded substrate having a top substrate surface and a bottom substrate surface; a semiconductor wafer embedded in the molded substrate; a bottom antenna structure disposed on the bottom substrate surface and electrically connected to the semiconductor wafer; and an antenna package embedded in the molded substrate, and includes: an antenna package substrate; and a top antenna structure disposed on the antenna package substrate and configured to couple electromagnetic energy with the bottom antenna structure.

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