Embedded semiconductor device packages and methods of manufacture

Abstract

In a general aspect, a method includes forming a panel including a heat spreader disposed in a non-conductive material. The heat spreader is exposed on opposite sides of the panel. The method further includes coupling a semiconductor die to a surface of the heat spreader with a conductive bonding material, and applying an underfill material to encapsulate the conductive bonding material. The method also includes plating a contact pad of the semiconductor die, embedding the semiconductor die and the underfill material in a lamination material, and disposing a metal layer on the lamination material. The method further includes forming an opening through the metal layer and the lamination material to expose at least a portion of the plating of the contact pad, and forming a conductive via in the opening. The conductive via electrically couples the metal layer with the plating of the contact pad.

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