Semiconductor packaging, semiconductor devices, and methods for manufacturing semiconductor packaging

Abstract

The objective of this invention is to improve testing efficiency during manufacturing and to miniaturize WLCSP (Wafer Level-Chip Size Package). The semiconductor package of this invention includes: a semiconductor substrate, a pixel region, a guard ring, and redistribution lines. In this semiconductor package, the pixel region is formed on the front side of the semiconductor substrate. The guard ring is formed around the pixel region. The redistribution lines are routed on the back side of the semiconductor substrate opposite to the aforementioned front side. The ends of the redistribution lines are located outside the aforementioned guard ring.

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