Semiconductor device
TW202633477APending Publication Date: 2026-08-01SAMSUNG ELECTRONICS CO LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- SAMSUNG ELECTRONICS CO LTD
- Filing Date
- 2026-01-14
- Publication Date
- 2026-08-01
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Figure TWG2TA001071693_001 
Figure TWG2TA001071693_002 
Figure TWG2TA001071693_003
Abstract
A semiconductor device is provided. The semiconductor device includes: a package substrate; an interposer provided on the package substrate; a plurality of chiplet dies provided on the interposer; and a plurality of capacitor dies provided on the interposer, the plurality of capacitor dies including a first capacitor die and a second capacitor die. The plurality of capacitor dies are provided among the plurality of chiplet dies, and a size of the first capacitor die is different from a size of the second capacitor die.
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