Perforated glass substrates for semiconductor packaging and glass substrates for semiconductor packaging

Abstract

The objective of this invention is to provide a glass substrate that is difficult to break when used as a core substrate or interlayer of an encapsulation substrate. The perforated glass substrate G1 and G2 of this invention are glass substrates G1 and G2 comprising a first main surface G1a, a first main surface G2a, a second main surface G1b and a second main surface G2b serving as opposite sides of the first main surface G1a and the first main surface G2a, and a hole formed on at least one of the first main surface G1a, the first main surface G2a, the second main surface G1b, and the second main surface G2b. The perforated glass substrate G1 and G2 are characterized in that the hole includes a non-through hole 2 formed on at least one of the first main surface G2a and the second main surface G2b, and / or a through hole 1 connecting the first main surface G1a and the second main surface G1b, and has a fracture toughness value of 0.8 MPa·m0.5 or higher.

Images