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TW202633480APending Publication Date: 2026-08-01KUPRION INC
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2026-01-12
Publication Date
2026-08-01

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Abstract

and 3D packaging solutions. The one or more openings include one or more through-glass vias and the one or more openings are metallized with a bulk copper matrix formed from fusion of metal nanoparticles or a reaction product formed from metal nanoparticles to provide an electrical connection.
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