Electronic package and substrate structure thereof

TW202633481APending Publication Date: 2026-08-01SILICONWARE PRECISION IND CO LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
SILICONWARE PRECISION IND CO LTD
Filing Date
2025-01-16
Publication Date
2026-08-01

Smart Images

  • Figure TWG2TA001069530_001
    Figure TWG2TA001069530_001
  • Figure TWG2TA001069530_002
    Figure TWG2TA001069530_002
  • Figure TWG2TA001069530_003
    Figure TWG2TA001069530_003
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Abstract

The present application provides an electronic package and substrate structure thereof. The substrate includes an insulating layer, a circuit layers, conductive vias and an insulating protective layer. The conductive via is free from being overlapped with the edge of an opening of the insulating protective layer to avoid stress concentration on the insulating protective layer during probe testing. Therefore, the insulation protective layer does not crack.
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