Electronic device and a method for making the same

Abstract

This application provides an electronic device and a method for forming the same. The electronic device includes: a first substrate; a plurality of electronic components mounted on the first substrate; a plurality of conductive structures, wherein each conductive structure is formed on and electrically connected to one of the plurality of electronic components, such that the respective plurality of top surfaces of the conductive structures are flush with each other; and a second substrate having a plurality of conductive pads formed thereon, wherein each conductive pad is mounted on one of the conductive structures via a set of solder bumps, such that the second substrate is mounted on the first substrate and electrically connected to the first substrate via the plurality of electronic components, the plurality of conductive structures, and the plurality of conductive pads.

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