Semiconductor package structure

TW202633492APending Publication Date: 2026-08-01ADVANCED SEMICON ENG INC
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
ADVANCED SEMICON ENG INC
Filing Date
2020-04-28
Publication Date
2026-08-01

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Abstract

The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.
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