Connecting device and connector

Abstract

The purpose of this invention is to suppress the adhesion of volatile components of resin to the bonding device through a simple structure. The invention includes: a bonding tool having a retaining surface and a back surface opposite to the retaining surface, wherein a semiconductor die is adsorbed on the retaining surface; a heater, in contact with the back surface, capable of conducting heat to the bonding tool; a body having the heater assembled at an end and forming a cooling gas flow path for supplying cooling air to the heater; and a gas discharge member assembled to the body, through which the cooling air flows in from the outlet of the cooling gas flow path, and having an opening at the outer edge of the bonding tool. The invention also includes a bonding head.

Images