Bonding method
TW202633495APending Publication Date: 2026-08-01ENNOSTAR CORP
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- ENNOSTAR CORP
- Filing Date
- 2025-01-23
- Publication Date
- 2026-08-01
Smart Images
Figure TWG2TA001069802_001 
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Figure TWG2TA001069802_003
Abstract
A bonding method is provided. The bonding method includes following steps. A component array including an array substrate and an electronic component is provided. The electronic component is located on the array substrate and includes a conductive bump. A first glue is formed to cover the electronic component and a portion of the conductive bump is exposed. A circuit substrate having an electrode is provided. The conductive bump is bonded with the electrode. The first glue is not fully cured during the process of bonding the conductive bump and the electrode.
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